lazeerer
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- May 25, 2010
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I... don't agree. On every single datasheet I have ever seen for an IC with both an SO package and a FN package, datasheet clearly states that the FN package has higher thermal conductivity, even when they both have thermal pads. It's because the larger ones have more PLASTIC to go through to get to ambient. But it's your call. :beer:
Why would it have to go through more plastic.? That doesn't make sense. Its a thermal pad. Its straight copper.:san:
Saying that a smaller chip is better is like saying a 1/2 inch block of aluminum for a heatsink is better then using a 1 inch block if both have the same contact surface to the heat source.
If both chips have thermal pads the larger package is just an extra bonus. The part that matters is the thermal pad. the larger chip has more mass even though its plastic or whatever its made out of. It also gives it better react time to heat.
Thats what i have noticed at least. I would take a larger package any day over a smaller package.IMO