H
High_Octane
Guest
CW PACKAGES
HHL
The HHL(High Heat Load) package is the largest standard
package available. It is a hermetically sealed package
approximately 1.5" square. The package is available with a
standard TEC which will stabilize the temperature of a 5 W laser
or with a high performance TEC (HPTEC) when a larger
temperture tuning range is required. The HHL package is
typically used when there is a large heat load (>2W diode) or
when a large temperature tuning range is desired.
This package is the preferred package for fibered applications. A
modified version of this package is used for our visible modules
(see fibered packages below)
Options available: Photodiode, Thermistor, FAC, Fibering, TEC, HPTEC
option combinations:
•HHL (HHL with no internal TEC)
•HHL-FAC (HHL with fast axis collimator)
•HHL-TEC (HHL with standard TEC, photodiode, thermistor)
•HHL-HPTEC (HHL with high performance TEC, photodiode, thermistor, photodiode)
•HHLF-TEC (Fibered HHL see fibered packages)
•HHLF-HPTEC (Visible module package)
•DUAL-HHLF (Visible module, 14 fibers)
T03
The TO3 is an eight pin diamond base hermetically sealed
package. It may be used with devices up to 5W without a TEC.
The TO3 package can include a standard TEC for 1W devices or
a high performance TEC for 2W devices.
Options available: Photodiode, Thermistor, FAC, Fibering, TEC, HPTEC
option combinations:
•TO3 (TO3 with no internal TEC)
•TO3-FAC (TO3 with fast axis collimator)
•TO3-TEC (TO3 with standard TEC, photodiode, thermistor, 1W diode maximum)
•TO3-HPTEC (TO3 with high performance TEC, photodiode, thermistor, photodiode, 2W diode maximum)
•TO3F-TEC (Fibered TO3 see fibered packages)
C-Mount
The C-mount is an open package suitable for devices with up to
5W output power with suitable heatsinking. This package is
typically used by OEM's who wish to take advantage of the
package's small size and the ability to place objects such as
lens very close to the laser facet. The disadvantage of this
package is that the diode is exposed and therefore subject to
mechanical damage.
Options available: FAC
option combinations:
•C
•C-FAC (C-mount with FAC)
9MM
The 9MM package is a sealed copper package suitable for
devices up to 2W output power. This is an ideal low cost
package for mid power applications where internal cooling is not
required. This package is also well suited for high volume applications.
Options available: photodiode, FAC
option combinations:
•9MM
•9MM-D (9mm with monitor photodiode)
•9MM-FAC (9mm with FAC lens)
•9MM-CN (case negative for short pulse devices)
TO56
The TO56 (5.6 mm) package is a hermetically sealed steel
package suitable for low power (<50mW) single mode devices
such as HPD's 4000 series.
Options available: photodiode
option combinations:
•TO56
•TO56-D (5.6 mm with monitor photodiode)
FIBERED PACKAGES
(see also cw packages, pulsed packages, package options)
HHLF
The HHLF(High Heat Load, fibered) package is the largest
fibered package available. It is a sealed package approximately
1.5" square. The package is available with a standard TEC
which will stabilize the temperature of a 5 W laser or a high
performance TEC (HPTEC) when a larger temperature tuning
range is required. Fibered packages typically use a fiber core
diameter equal to the laser source size (see data sheets) with a
reduction in power of approximately 30%.This package is used
for visible modules (5200 and 5300 series lasers)
Options available: Photodiode, Thermistor, FAC, Fibering, TEC, HPTEC
option combinations:
•HHLF (HHLF with no internal TEC)
•HHLF-TEC (HHLF with TEC, monitor photodiode and
thermistor)
•HHLF-HPTEC (Visible module package with TEC,
monitor photodiode and thermistor)
•DUAL-HHLF-HPTEC (Visible module package ,14 fibers,
with TEC, monitor photodiode and thermistor)
•HHLF Assembly Drawing (Visible module package)
T03F
The TO3F is an eight pin diamond base sealed package. It may
be used with devices up to 5W without a TEC or up to 2W with a
high performance TEC. Fibered packages typically use a fiber
core diameter equal to the laser source size (see data sheets)
with a reduction in power of approximately 30%.
Options available: Photodiode, Thermistor, Fibering, TEC, HPTEC
option combinations:
•TO3F (TO3 with no internal TEC)
•TO3F-TEC (TO3F with standard TEC, photodiode,
thermistor, 1W diode maximum)
•TO3F-HPTEC (TO3F with high performance TEC,
photodiode, thermistor, photodiode, 2W diode
maximum)
T0259
The TO259 is a three pin sealed package. It may be used with
devices up to 5W. This package is available in a hermetically
sealed version. It is ideal for low cost fibered applications
where an internal TEC is not required.
Fibered packages typically use a fiber core diameter equal to
the laser source size (see data sheets) with a reduction in
power of approximately 30%.
Options available: Photodiode, Thermistor,
option combinations:
•TO259
•TO259-D (TO259 with monitor photodiode)
•TO259-TH (TO259 with thermistor)
BUTF
The Butterfly (BUTF) package is an industry standard 14 pin
DIP package/ It may be used with devices up to 1W with a
standard TEC or up to 2W with a high performance TEC. This
package is available in a hermetically sealed version. It is ideal
for low power fibered applications where an internal TEC is required.
Fibered packages typically use a fiber core diameter equal to
the laser source size (see data sheets) with a reduction in
power of approximately 30%.
Options available: photodetector, thermistor, FAC, Fibering,
TEC, HPTEC
option combinations:
•BUTF
•BUTF-TEC ( BUTF with standard TEC, photodiode,
thermistor, 1W diode maximum)
•BUTF-HPTEC ( BUTF with high performance TEC,
photodiode, thermistor, 2W diode maximum)
PULSED PACKAGES
(designed for 200ns, 2kHz, low power dissipation) (see also fibered packages, cw packages, package options)
9MM
The 9MM package is a low cost hermetically sealed package.
This package is well suited for high volume applications.
Options available: photodetector, Stacks
option combinations:
•9MM
•9MM-D (9mm with monitor photodiode)
TO5
The TO5 package is a two pin hermetically sealed steel package
with the low inductance. The laser leads are isolated from the
case. The case has a threaded block for mounting purposes.
Options available: Stacks
option combinations:
•TO5
TO56
The TO56 (5.6 mm) package is a hermetically sealed steel
package with the lowest inductance of standard packages.
Options available: photodetector, Stacks
option combinations:
•TO56
•TO56-D (5.6 mm with monitor photodiode)
T018
The TO18 is a hermetically sealed coaxial package with a single
lead. The threaded case makes it extremely easy to mount into a heatsink.
Options Available: Stacks
option combinations:
•TO18
Open-Cavity Diodes
Diodes used in most high power devices are inherently open. It is shown that under such circum-
stances, there is a loss of electromagnetic radiation leading to a lower critical current as compared
to closed diodes.The power loss can be incorporated in the standard Child-Langmuir framework
by introducing an effective potential.The modified Child-Langmuir law can be used to predict the
maximum power loss for a given plate separation and potential difference as well as the maximum
transmitted current for this power loss.The effectiveness of the theory is tested numerically.
Package Options
(not all options are available with every package. See above for details, see also cw packages, fibered packages, pulsed packages)
D
Monitor Photodiode: A photodiode is used to measure the light out
of the laser by monitoring scattered light inside the package. This
can be used in a power feedback loop for CW devices and a range
zero pulse for pulsed devices. Since the signal level is dependent on
scattered light, the value of the responsivity in any given package
can vary widely (see device specifications). The use of a monitor
photodiode should be verified in each new application.
•Detector Parameters
•HPD4005 Detector Current Histogram
•HPD4050 Detector Current Histogram
TH
A thermistor is a temperature measuring device which is typically
used in a feedback loop to stabilize the temperature of the laser.
HPD uses a NTC (negative temperature coefficient) thermistor with
a 10,000 Ohm resistance at 25C.
•TEC/Thermistor Parameters
FAC
A Fast axis colimator (FAC) is a cylindircal lens mounted directly to
the laser submount which decreases the fast axis of the laser
emission from 40 degrees to approximately 2 degrees. Coupling
loss through a FAC is typically 5%.
•Typical Farfield of FAC
Sources:
Open-Cavity Diode: information from Debabrata Biswas and Raghwendra Kumar
Most other information was from:
HHL
The HHL(High Heat Load) package is the largest standard
package available. It is a hermetically sealed package
approximately 1.5" square. The package is available with a
standard TEC which will stabilize the temperature of a 5 W laser
or with a high performance TEC (HPTEC) when a larger
temperture tuning range is required. The HHL package is
typically used when there is a large heat load (>2W diode) or
when a large temperature tuning range is desired.
This package is the preferred package for fibered applications. A
modified version of this package is used for our visible modules
(see fibered packages below)
Options available: Photodiode, Thermistor, FAC, Fibering, TEC, HPTEC
option combinations:
•HHL (HHL with no internal TEC)
•HHL-FAC (HHL with fast axis collimator)
•HHL-TEC (HHL with standard TEC, photodiode, thermistor)
•HHL-HPTEC (HHL with high performance TEC, photodiode, thermistor, photodiode)
•HHLF-TEC (Fibered HHL see fibered packages)
•HHLF-HPTEC (Visible module package)
•DUAL-HHLF (Visible module, 14 fibers)
T03
The TO3 is an eight pin diamond base hermetically sealed
package. It may be used with devices up to 5W without a TEC.
The TO3 package can include a standard TEC for 1W devices or
a high performance TEC for 2W devices.
Options available: Photodiode, Thermistor, FAC, Fibering, TEC, HPTEC
option combinations:
•TO3 (TO3 with no internal TEC)
•TO3-FAC (TO3 with fast axis collimator)
•TO3-TEC (TO3 with standard TEC, photodiode, thermistor, 1W diode maximum)
•TO3-HPTEC (TO3 with high performance TEC, photodiode, thermistor, photodiode, 2W diode maximum)
•TO3F-TEC (Fibered TO3 see fibered packages)
C-Mount
The C-mount is an open package suitable for devices with up to
5W output power with suitable heatsinking. This package is
typically used by OEM's who wish to take advantage of the
package's small size and the ability to place objects such as
lens very close to the laser facet. The disadvantage of this
package is that the diode is exposed and therefore subject to
mechanical damage.
Options available: FAC
option combinations:
•C
•C-FAC (C-mount with FAC)
9MM
The 9MM package is a sealed copper package suitable for
devices up to 2W output power. This is an ideal low cost
package for mid power applications where internal cooling is not
required. This package is also well suited for high volume applications.
Options available: photodiode, FAC
option combinations:
•9MM
•9MM-D (9mm with monitor photodiode)
•9MM-FAC (9mm with FAC lens)
•9MM-CN (case negative for short pulse devices)
TO56
The TO56 (5.6 mm) package is a hermetically sealed steel
package suitable for low power (<50mW) single mode devices
such as HPD's 4000 series.
Options available: photodiode
option combinations:
•TO56
•TO56-D (5.6 mm with monitor photodiode)
FIBERED PACKAGES
(see also cw packages, pulsed packages, package options)
HHLF
The HHLF(High Heat Load, fibered) package is the largest
fibered package available. It is a sealed package approximately
1.5" square. The package is available with a standard TEC
which will stabilize the temperature of a 5 W laser or a high
performance TEC (HPTEC) when a larger temperature tuning
range is required. Fibered packages typically use a fiber core
diameter equal to the laser source size (see data sheets) with a
reduction in power of approximately 30%.This package is used
for visible modules (5200 and 5300 series lasers)
Options available: Photodiode, Thermistor, FAC, Fibering, TEC, HPTEC
option combinations:
•HHLF (HHLF with no internal TEC)
•HHLF-TEC (HHLF with TEC, monitor photodiode and
thermistor)
•HHLF-HPTEC (Visible module package with TEC,
monitor photodiode and thermistor)
•DUAL-HHLF-HPTEC (Visible module package ,14 fibers,
with TEC, monitor photodiode and thermistor)
•HHLF Assembly Drawing (Visible module package)
T03F
The TO3F is an eight pin diamond base sealed package. It may
be used with devices up to 5W without a TEC or up to 2W with a
high performance TEC. Fibered packages typically use a fiber
core diameter equal to the laser source size (see data sheets)
with a reduction in power of approximately 30%.
Options available: Photodiode, Thermistor, Fibering, TEC, HPTEC
option combinations:
•TO3F (TO3 with no internal TEC)
•TO3F-TEC (TO3F with standard TEC, photodiode,
thermistor, 1W diode maximum)
•TO3F-HPTEC (TO3F with high performance TEC,
photodiode, thermistor, photodiode, 2W diode
maximum)
T0259
The TO259 is a three pin sealed package. It may be used with
devices up to 5W. This package is available in a hermetically
sealed version. It is ideal for low cost fibered applications
where an internal TEC is not required.
Fibered packages typically use a fiber core diameter equal to
the laser source size (see data sheets) with a reduction in
power of approximately 30%.
Options available: Photodiode, Thermistor,
option combinations:
•TO259
•TO259-D (TO259 with monitor photodiode)
•TO259-TH (TO259 with thermistor)
BUTF
The Butterfly (BUTF) package is an industry standard 14 pin
DIP package/ It may be used with devices up to 1W with a
standard TEC or up to 2W with a high performance TEC. This
package is available in a hermetically sealed version. It is ideal
for low power fibered applications where an internal TEC is required.
Fibered packages typically use a fiber core diameter equal to
the laser source size (see data sheets) with a reduction in
power of approximately 30%.
Options available: photodetector, thermistor, FAC, Fibering,
TEC, HPTEC
option combinations:
•BUTF
•BUTF-TEC ( BUTF with standard TEC, photodiode,
thermistor, 1W diode maximum)
•BUTF-HPTEC ( BUTF with high performance TEC,
photodiode, thermistor, 2W diode maximum)
PULSED PACKAGES
(designed for 200ns, 2kHz, low power dissipation) (see also fibered packages, cw packages, package options)
9MM
The 9MM package is a low cost hermetically sealed package.
This package is well suited for high volume applications.
Options available: photodetector, Stacks
option combinations:
•9MM
•9MM-D (9mm with monitor photodiode)
TO5
The TO5 package is a two pin hermetically sealed steel package
with the low inductance. The laser leads are isolated from the
case. The case has a threaded block for mounting purposes.
Options available: Stacks
option combinations:
•TO5
TO56
The TO56 (5.6 mm) package is a hermetically sealed steel
package with the lowest inductance of standard packages.
Options available: photodetector, Stacks
option combinations:
•TO56
•TO56-D (5.6 mm with monitor photodiode)
T018
The TO18 is a hermetically sealed coaxial package with a single
lead. The threaded case makes it extremely easy to mount into a heatsink.
Options Available: Stacks
option combinations:
•TO18
Open-Cavity Diodes
Diodes used in most high power devices are inherently open. It is shown that under such circum-
stances, there is a loss of electromagnetic radiation leading to a lower critical current as compared
to closed diodes.The power loss can be incorporated in the standard Child-Langmuir framework
by introducing an effective potential.The modified Child-Langmuir law can be used to predict the
maximum power loss for a given plate separation and potential difference as well as the maximum
transmitted current for this power loss.The effectiveness of the theory is tested numerically.
Package Options
(not all options are available with every package. See above for details, see also cw packages, fibered packages, pulsed packages)
D
Monitor Photodiode: A photodiode is used to measure the light out
of the laser by monitoring scattered light inside the package. This
can be used in a power feedback loop for CW devices and a range
zero pulse for pulsed devices. Since the signal level is dependent on
scattered light, the value of the responsivity in any given package
can vary widely (see device specifications). The use of a monitor
photodiode should be verified in each new application.
•Detector Parameters
•HPD4005 Detector Current Histogram
•HPD4050 Detector Current Histogram
TH
A thermistor is a temperature measuring device which is typically
used in a feedback loop to stabilize the temperature of the laser.
HPD uses a NTC (negative temperature coefficient) thermistor with
a 10,000 Ohm resistance at 25C.
•TEC/Thermistor Parameters
FAC
A Fast axis colimator (FAC) is a cylindircal lens mounted directly to
the laser submount which decreases the fast axis of the laser
emission from 40 degrees to approximately 2 degrees. Coupling
loss through a FAC is typically 5%.
•Typical Farfield of FAC
Sources:
Open-Cavity Diode: information from Debabrata Biswas and Raghwendra Kumar
Most other information was from:
)
If anyone happens to run across anything on these diodes please post it here. Thanks.
