HIMNL9
0
- Joined
- May 26, 2009
- Messages
- 5,318
- Points
- 0
Just some considerations (so you can hate me j/k )
First, closed cans can become damaged as the others, cause the extreme low temperatures can detach or shatter the window (more than other the temperature change, but you have also to considerate that the expansion / contraption rate of the can (metal) is usually not the same of the window, and the mechanical stress can cause detach of the glue or damage of the glass.
Same consideration, also if for a different thing, can be made about the chip ..... don't think to the soldering material, that have a rate similar to the glass, but about the metallic part where the chip is soldered on ? ..... usually, in the constructive process, is kept in consideration the increase of the temperature, not so much the decreasing of it ..... ok, the wavelenght can change a bit, cause also when the chip contract, the distance between the resonant faces (coating) decrease, but if the decreasing rate of the metal support is too much different of the one of the chip material, there's always the risk of breaking (chips and creeks) ..... especially pumping in the chip a big amount of energy, when it's at very low temperatures, making it expanding more quick than the support (but, maybe, IF it can work fully immersed in the cooling liquid .....)
Also about this ..... as you probably know, reflection characteristics of surfaces changes when you change the medium in which they are immersed (think to glass in air and water differences) ...... in full immersion in a liquid, the dielectric coating that make the resonant cavity, can, maybe, change its reflective properties enough to make the chip just not lasing, or changing it basically ?
Just an idea
First, closed cans can become damaged as the others, cause the extreme low temperatures can detach or shatter the window (more than other the temperature change, but you have also to considerate that the expansion / contraption rate of the can (metal) is usually not the same of the window, and the mechanical stress can cause detach of the glue or damage of the glass.
Same consideration, also if for a different thing, can be made about the chip ..... don't think to the soldering material, that have a rate similar to the glass, but about the metallic part where the chip is soldered on ? ..... usually, in the constructive process, is kept in consideration the increase of the temperature, not so much the decreasing of it ..... ok, the wavelenght can change a bit, cause also when the chip contract, the distance between the resonant faces (coating) decrease, but if the decreasing rate of the metal support is too much different of the one of the chip material, there's always the risk of breaking (chips and creeks) ..... especially pumping in the chip a big amount of energy, when it's at very low temperatures, making it expanding more quick than the support (but, maybe, IF it can work fully immersed in the cooling liquid .....)
Also about this ..... as you probably know, reflection characteristics of surfaces changes when you change the medium in which they are immersed (think to glass in air and water differences) ...... in full immersion in a liquid, the dielectric coating that make the resonant cavity, can, maybe, change its reflective properties enough to make the chip just not lasing, or changing it basically ?
Just an idea