rhd
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We never design on the edge... it is called a reliability buffer
factor..
That may be silly to you... but our defective or returned
products count is virtually non existent...
No, I'm not saying design on the edge. There's a curve, it's in the datasheet, and it's meant to be used. If you're designing a driver for a particular point on a curve, there's nothing wrong (in fact, it's appropriate) to plan for the corresponding values that appear on that curve. I don't have the 1085 datasheet in front of me, but often times they'll actually include 3 different slopes. One for typical, and the other two for min/max. Or sometimes three for different operating temperatures.
If 1.8A implies a different dropout than the same IC would at 3A, it's completely appropriate, and not "designing on the edge" to plan around the supplied data you have for your particular current.
I'm completely with you on the notion of not engineering around a purely ideal-world scenario. But I don't think that's what you're doing if you intelligently factor in a dropout that corresponds to the current level you're designing for. Especially now that some of these LDO ICs are meant for currents as high as 7 or 8A, it just wouldn't make sense to design around the max-dropout, if you're not ever going to exceed 2A, etc.
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