Available literature seems to imply the Lasorb diode protection device needs to be connected to within 1cm (1cm maximum distance) from the laser diode pins. If the Lasorb device is located/connected too far away from the laser diode, the ESD protection which the Lasorb is meant to provide, decreases significantly
If a copper back-half heatsink is used, this makes meeting the 1cm maximum distance requirement difficult to meet because the copper back-half is longer than 1cm and there is no room to attach the Lasorb within 1cm of the laser diode pins.
If I connect, via 2-3cm long silicone wires, the Lasorb device and solder the silicone wires themselves close to the diode pins while the Lasorb device itself is greater than 1cm away from the laser diode, will this work or is it still considered a violation of the 1cm max distance requirement?
If a copper back-half heatsink is used, this makes meeting the 1cm maximum distance requirement difficult to meet because the copper back-half is longer than 1cm and there is no room to attach the Lasorb within 1cm of the laser diode pins.
If I connect, via 2-3cm long silicone wires, the Lasorb device and solder the silicone wires themselves close to the diode pins while the Lasorb device itself is greater than 1cm away from the laser diode, will this work or is it still considered a violation of the 1cm max distance requirement?