BodhiSci
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- Joined
- Dec 11, 2014
- Messages
- 64
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If a heatsink is custom, would it be better to just use just the front of 12x30mm module with some thermal paste (and not have the 12mm diameter hole go back the full 30mm, only a small hole for the wires).
I'm thinking that the heat capacity of the larger sink (less drilled out) would be higher with the thermal paste maintaining a good transfer from the copper section. It might not be aligned straight forward as well though with the shorter length and would not be nearly as clean\easy when swapping out or removing the diode\module.
I was thinking the back of the module might facilitate transfer away from the copper diode section (the additional surface area on the threading). But I think that it couldn't be as good as transfer from the entire backside of the copper portions with thermal paste. All that solid metal in the large heatsink would have less heat transfer resistance than a thin module back portion I'd think, certainly more capacity. Again, there are a few drawbacks which I mentioned.
Thanks!
I'm thinking that the heat capacity of the larger sink (less drilled out) would be higher with the thermal paste maintaining a good transfer from the copper section. It might not be aligned straight forward as well though with the shorter length and would not be nearly as clean\easy when swapping out or removing the diode\module.
I was thinking the back of the module might facilitate transfer away from the copper diode section (the additional surface area on the threading). But I think that it couldn't be as good as transfer from the entire backside of the copper portions with thermal paste. All that solid metal in the large heatsink would have less heat transfer resistance than a thin module back portion I'd think, certainly more capacity. Again, there are a few drawbacks which I mentioned.
Thanks!