- Joined
- Feb 22, 2012
- Messages
- 130
- Points
- 0
So, could one devise a two-part heat sink design with a high heat capacity material in contact with/around the diode, and a high thermal conductivity material around that... or would it be better the other way around - get the heat away from the diode as fast as possible, then move it into a larger mass that can absorb it?
T.
T.
Last edited: