- Joined
- Dec 23, 2007
- Messages
- 2,494
- Points
- 0
Cool :gj:
I have something else you might test, if you don't mind.
Whenever I build a high power build I usually solder on the wires then I put a blob of thermal epoxy (arctic alumina) on the back of the module. My thinking was that it at the very least holds the pins secure, and hopefully helps it dissipate heat better since it contacts the large open area on the back of the diode.
Also I was thinking that on my next build I would take the back barrel and cut it off maybe 1cm past the threads then screw that little ring onto the module (with thermal paste in the threads). That should give it better heat dissipation because in a module without a back barrel the threaded part (which is in line with the diode and is on the main heatsinking area of the module) never touches the heatsink so the heat has to travel up into the thin walls of the focusing part of the module to transfer to the heatsink.
I think if you do both of those things it should give much better heat dissipation.
If you do this I suggest you coat the threads in thermal paste before you thread them together. The actual mechanical contact area is well below 50% with those loose threads, filling that gap with thermal paste can only help.
Or, you could get one of these from me! They thread over the back of an aixiz module and contact the back of the diode and fill the thread space. Thermal paste would be a benefit here too..
I'm curious if solid copper is even a benefit over copper plated modules. Would you be willing to test that for me if I send a module to you wannaburn?