sinner
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- Oct 27, 2011
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I have a few questions about this part.... for the thermal epoxy I'm going to use to sink my benboost mini v5 to the pill, I purchased THIS
Now I dont know much about the driver itself, but I was told by Moh to heatsink the part of the driver that has a little copper bar on it. This thermal epoxy I'm using says it is for permanent jobs, not for use on things like CPUs.
Now I also see you guys also saying to use thermal paste on the module, where it meets with the heatsink. Seeing as how this thermal epoxy I bought has two syringes, I am assuming one is the actual thermally conductive paste, and the other is the resin that cures it. Would I be ok using the paste stuff or do I need to order a separate compound, like regular old CPU paste?
And in regards to using thermal paste on the pill where it meets the heatsink, is that really necessary? Or between the heatsink and host? I didnt think the fit would be tight enough between the heatsink and host to actually benefit from compound there, at least thats how it is with my greenie....
Thats a very good question actually, I have no specific data or arbitrary recommendation for the use on one part out of the two-part epoxy to use just as thermal grease. For this purpose you might be able to find some information on the arctic silver's official website..
But i would assume the one with micronized particles would be the one to use, and the other one would be the curing agent..
For the purpose of mounting the ben-boost driver this adhesive is the best buy out there in the <$10 range.. And i think he's suggesting you to sink the driver just fine..
As far as the heatsinking of heatsink-to-host and heatsink to pill is concerned i think you dont need it because you are just building a basic laser assembly with a requirement of a duty cycle, and for this 60s/60s i dont suppose this would be just fine either way! but doing so will satisfy your doubts which you may/maynot have if any!