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I couldn't find a subforum for this topic so that is why I am posting in General.
First off, I'm curious about what metal these Aixiz modules are actually made from. I'm worried about their ability to transfer heat from the LD to the rest of the (preferably aluminum or copper) host in an effective fashion.
My experience with electronics has been primarily with computers. So I have become quite anal over the years about that all-important thermal interface between a CPU and its heatsink. Everybody knows that you're asking for trouble if you do not use some form of thermal interface compound material to join the surfaces.
So here's the problem. A lot of laser builds have no straightforward soldering point in order to connect the case (battery minus terminal) to the V- in on the driver. In my experience the only clean solution (if using a case neutral diode) is to connect the case pin on the diode to the V- of the driver board. Because pins like the ones on the diodes are pretty much the only little protruding bits of metal that I can effectively solder!
This is great if the diode has good electrical contact with the Aixiz module (it's a press-fit. Check.), the Aixiz module has good electrical contact with the heatsink (this is the interface I have a problem with), and the heatsink has good electrical contact with a part of the host that is directly connected to the battery's negative terminal (I have never had a problem here. Check.).
Now I understand that a CPU thermal interface has to transfer 100W of heat effectively and we're talking about well under 20W for the beefiest 445nm diode we've got, but simply using some set screws to secure the module inside the heatsink is not likely to provide more than 5% of actual contact area assuming we don't have precision engineered parts. My suspicion is that even though our typical heatsink solution will work well enough to prevent our diodes from melting, it's going to cause the diode assembly to heat up a lot and stay really hot.
Let's see here: Google tells me that 12mm*pi*8mm = about 300mm^2 area, 5% of this is 15mm^2 contact area. Let's see. assuming the materials are both aluminum i've got one quantity left in the Q=kA/L equation where k = thermal conductivity of Al, A = 15mm^2 and I'm not sure what L has to be...
So I do not have the means to measure the temperature that the diode/Aixiz assembly heats up to in order to see if this is a problem. Ideally I want to measure the effectiveness of that naked metal thermal interface to see if a better thermal interface would be helpful.
When I use thermal compound in the aixiz-to-heatsink interface, thereby (hypothetically) dramatically increasing thermal conductivity at that juncture, it destroys the circuit and I must find a way to connect the driver V- input to the host in another way. This is often quite difficult. What I tend to do a lot is squish copper wire (soldered to the V-) into some thread or junction somewhere where manual tightening can be applied. It works, but is not such a "clean" solution!
The reason I am overanalyzing this issue is because I have a 500mw Mits 635 diode sitting here that I want to keep cool as much as I can, but I have no direct-press heatsink solutions available. I do on the other hand have an Aixiz module and an Aixiz module receptive heatsink that Mr. flaminpyro kindly built for me a while back.
The issue is that once I press the Open Can 500mw Mits 635 diode into an Aixiz, it's not ever coming out of that Aixiz. And I'm just trying to find an adequate thermal solution which does not involve my copper wire hack. Like, yeah, I'll put up with the copper wire hack if it means I get to keep the diode a bit cooler. But maybe there is an even smarter solution I haven't stumbled into yet!
Whew. Thanks for reading all the way to the end! :beer:
First off, I'm curious about what metal these Aixiz modules are actually made from. I'm worried about their ability to transfer heat from the LD to the rest of the (preferably aluminum or copper) host in an effective fashion.
My experience with electronics has been primarily with computers. So I have become quite anal over the years about that all-important thermal interface between a CPU and its heatsink. Everybody knows that you're asking for trouble if you do not use some form of thermal interface compound material to join the surfaces.
So here's the problem. A lot of laser builds have no straightforward soldering point in order to connect the case (battery minus terminal) to the V- in on the driver. In my experience the only clean solution (if using a case neutral diode) is to connect the case pin on the diode to the V- of the driver board. Because pins like the ones on the diodes are pretty much the only little protruding bits of metal that I can effectively solder!
This is great if the diode has good electrical contact with the Aixiz module (it's a press-fit. Check.), the Aixiz module has good electrical contact with the heatsink (this is the interface I have a problem with), and the heatsink has good electrical contact with a part of the host that is directly connected to the battery's negative terminal (I have never had a problem here. Check.).
Now I understand that a CPU thermal interface has to transfer 100W of heat effectively and we're talking about well under 20W for the beefiest 445nm diode we've got, but simply using some set screws to secure the module inside the heatsink is not likely to provide more than 5% of actual contact area assuming we don't have precision engineered parts. My suspicion is that even though our typical heatsink solution will work well enough to prevent our diodes from melting, it's going to cause the diode assembly to heat up a lot and stay really hot.
Let's see here: Google tells me that 12mm*pi*8mm = about 300mm^2 area, 5% of this is 15mm^2 contact area. Let's see. assuming the materials are both aluminum i've got one quantity left in the Q=kA/L equation where k = thermal conductivity of Al, A = 15mm^2 and I'm not sure what L has to be...
So I do not have the means to measure the temperature that the diode/Aixiz assembly heats up to in order to see if this is a problem. Ideally I want to measure the effectiveness of that naked metal thermal interface to see if a better thermal interface would be helpful.
When I use thermal compound in the aixiz-to-heatsink interface, thereby (hypothetically) dramatically increasing thermal conductivity at that juncture, it destroys the circuit and I must find a way to connect the driver V- input to the host in another way. This is often quite difficult. What I tend to do a lot is squish copper wire (soldered to the V-) into some thread or junction somewhere where manual tightening can be applied. It works, but is not such a "clean" solution!
The reason I am overanalyzing this issue is because I have a 500mw Mits 635 diode sitting here that I want to keep cool as much as I can, but I have no direct-press heatsink solutions available. I do on the other hand have an Aixiz module and an Aixiz module receptive heatsink that Mr. flaminpyro kindly built for me a while back.
The issue is that once I press the Open Can 500mw Mits 635 diode into an Aixiz, it's not ever coming out of that Aixiz. And I'm just trying to find an adequate thermal solution which does not involve my copper wire hack. Like, yeah, I'll put up with the copper wire hack if it means I get to keep the diode a bit cooler. But maybe there is an even smarter solution I haven't stumbled into yet!
Whew. Thanks for reading all the way to the end! :beer:
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