I am in the process of building a WF 501B M140 project with 1.8A Lazeerer X-Drive and Eudamonium WF501B heatsink (for the diode).
As I'm reading through this forum, I see that some of you attach a separate small copper heatsink on the driver board. I see others attach the driver to the diode heatsink by means of thermal epoxy. Yet there are still others that don't heatsink the driver board at all.
While 1.8A may well be a serious load for the M140, I will run it at short duty cycles, like 30sec or so at max.
Would it be OK to glue the driver board inside the Euda sink with thermal compound, or would you say that a separate heatsink is better (or required!)?
As I'm reading through this forum, I see that some of you attach a separate small copper heatsink on the driver board. I see others attach the driver to the diode heatsink by means of thermal epoxy. Yet there are still others that don't heatsink the driver board at all.
While 1.8A may well be a serious load for the M140, I will run it at short duty cycles, like 30sec or so at max.
Would it be OK to glue the driver board inside the Euda sink with thermal compound, or would you say that a separate heatsink is better (or required!)?