Heat Sinking

I am looking to do some builds and I would like to try and over-engineer them in regards to heat sinking. I am looking at a variety of methods and realizing that space is a primary concern in many builds, I was wondering if anyone has any experience with pads like these?

My thinking was to try and use these on the drivers where possible.

Amazon.com: Xbox 360 Thermal Pads - 1 Set RAM Thermal K Pads (4 PCS) for XBOX RAM Chips - Upgrade Cooling Repair - Prevent RROD: Computers & Accessories

Any thoughts?

This thermal pads are normally used when there is too much space between the chip
(or other to cool) and the heat sink, and the use of thermal paste is not possible or very difficult.

One example, this memory chips are lower than the GPU in this case, and to solve this
easily here is used these pads (color pink in the photo ) with the correct thickness
to make contact with the heatsink when is in place.



Also often used in other devices where the housing (chassis) of the device itself makes
heat sink, and also where there is usually plenty of space and the use of thermal paste
is not advisable, see the photo also as an example of this.



There are other examples, but as a rule that whenever you can use a good
thermal paste with a heat sink is much better than using thermal pads
because its thermal conduction is not very good.

They're probably better than air.

^^ ha, ha, very funny, of course yes, this is evident