so I was looking at some Sony diodes in the 4000mW range, and noticed they were thermoelectrically cooled. I'd never heard of such a thing (nothing new about that), and I began searching for a cylinder variant to see if it could be used in a host. I didn't see any cylinder versions, only flat cooling plates. The Wiki example uses a USB plug to as a cooling plate for drinks, and I concluded this technology has micronization potential.
The first idea is a cylinder "blanket" wrapping around so the inner plate is in contact with the surface normally used for a heat sink, while the outer surface is exposed to bleed off the heat.
The alternative to this is placing the heat sink within the cylindrical TEC so the direct contact can suck up the heat from the sink and radiate the heat to the outer surface (clearly I have no idea what I'm talking about).
The second idea is a hex of six strips of TEC plates making contact with the heat sink, like a glorified socket from a socket wrench.
I don't know enough about this technology yet to do any experiments with it, but it seemed like a spiffy idea.
The first idea is a cylinder "blanket" wrapping around so the inner plate is in contact with the surface normally used for a heat sink, while the outer surface is exposed to bleed off the heat.
The alternative to this is placing the heat sink within the cylindrical TEC so the direct contact can suck up the heat from the sink and radiate the heat to the outer surface (clearly I have no idea what I'm talking about).
The second idea is a hex of six strips of TEC plates making contact with the heat sink, like a glorified socket from a socket wrench.
I don't know enough about this technology yet to do any experiments with it, but it seemed like a spiffy idea.