Direct press? or copper module?

One thing I did wonder, I am trying to get the best dissapation of heat as I can without resorting to TECs or active cooling, is it best to have the host a direct press one, where I will pressfit the diode right into the host itself (which is made out of aluminum, and also, will anodization help in any significant way to aid heat convection?)

or would it be better off to make a 1" wide copper module that will house the lens and the diode itself, and just pressfit it into the host?

More or less my question is, direct press host VS pressfit copper module, which would be better to achive the most effective cooling without resorting to thermoelectric or active cooling?

My own thinking is that a copper module will work better, as it dissapates heat 2X faster then aluminum, but the thing that puzzles me is that while it dissapates faster, there is now a new layer between the copper and aluminum, which might create losses the copper was supposed to make up for. but I am not certain to which one is the correct method.

Here is the laser head and if the module the better option, it will sit flush with the head. This head is fairly big as it is, but I would like to make the best out of it. (I will most likly use it either for a ~2W 445, or a high power pump doide for a green).

Thank you for any help.

The head is roughly 2.5" in daimeter, and the top "stage" bieng ~1.5" so room for a module is no issue.

Direct press is best and direct press into copper is even better

One thing I did not understand though, assuming I do direct press, then we can expect that the diode will dissapate the heat at 1X rate. with a copper module, we can dissapate 2X (general idea as copper transfers faster then aluminum, but dissapates poorer as it likes to hold onto the heat).

So 2X the transfer, but then 1X dissapation (and some losses by the two seperate metals joining), wouldn't this make it have a faster transfer from diode to the air in form of convection? or the help of copper will more or less be canceled out by the seperation between the metals, even though thermal paste is used?

More or less what Im asking, is there really a significant difference between using direct press or copper module? (I am going to use direct press like you said btw, but I just wonder out of argument's sake).

Copper has a much higher thermal transfer rate. Copper will transfer heat to another medium faster than aluminum as well. How long any material 'holds on' to heat is more of a factor of it's radiating surface area and the transfer rate of the surrounding material than the material itself. You could have a material with an infinitely high thermal transfer rate, but if that material is wrapped in something with a low transfer rate, then the high transfer rate gains you nothing, since the heat dissipation is limited by the rate of the surrounding material.