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Ok my original plan was to put a 445nm diode in a 12mm aixiz module in a CPU heat sink like this
but then I figured instead I could just use a brick of copper. Now my question is this. Which one will provide better heat sinking capability. I would assume the brick is better but I'm not sure that it would be as good as a radial CPU heat sink with a fan. So what are everyones thoughts on this?
:thanks:
but then I figured instead I could just use a brick of copper. Now my question is this. Which one will provide better heat sinking capability. I would assume the brick is better but I'm not sure that it would be as good as a radial CPU heat sink with a fan. So what are everyones thoughts on this?
:thanks: