weidmark
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- Sep 19, 2010
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Hi, I was wondering if this "S" design would heatsink a driver enough.
I thought since there is a lot of surface contact between the copper and host it would be ok, but then i thought maybe not because it is just a thin sheet of copper and i always see builds with big heavy heatsinks.
And this next one is easier to do but i dont know how it will be since there is a lot of thermal compound needed to fill in the gap. ( this stuff http://www.canadacomputers.com/product_info.php?cPath=8_128&item_id=021295 if it matters)
Thanks!:thanks:
I thought since there is a lot of surface contact between the copper and host it would be ok, but then i thought maybe not because it is just a thin sheet of copper and i always see builds with big heavy heatsinks.
And this next one is easier to do but i dont know how it will be since there is a lot of thermal compound needed to fill in the gap. ( this stuff http://www.canadacomputers.com/product_info.php?cPath=8_128&item_id=021295 if it matters)
Thanks!:thanks:
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