@cilegray, that sounds like a neat trick. Do you have any suggestions like 10% compound to 90% adhesive, etc? Difficult to remove is OK, but their adhesive is more like epoxy right now.
I finished my assembly today with the Schottky Barrier diodes, and @1.8A the 1N5404's pretty much match that chart above @0.81V measured. My 1N5822's were 0.39V; so it takes twice as many diodes and the heat is more spread-out. (But you lose the ability to test Blu-Ray diodes). They eventually get hot without a heat sink anyway, but water boils on the resistor long before I can get it to evaporate on the diodes. For me; I'm fine without a heat sink for non-continuous testing. I also soldered all of the hot components (diodes and resistor) slightly off the board so it doesn't cook it as much.
@ Jufran88--it works out great but I had one suggestion if possible. Make the through holes a little bigger for the diodes, resistor, and load terminals. Right now, they all fit tight.
I used to be a tech for Marquette electronics (6 months fixing Medical boards) and I never had a board where the component's leads fit snugly...you want a little space for soldering and de-soldering with a solder sucker. (There should be some space between the wires and the hole for a vacuum to pull the solder out).
Anyway, it's a great little board for the money and you might want to put something in the pro section so you get more visibility.
Happy soldering!