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ArcticMyst Security by Avery
Blu ray and Arctic silver
- Thread starter tony70516
- Start date
- Joined
- May 14, 2008
- Messages
- 468
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- 0
pseudolobster:
you're right, I regret I did not detail with the exact words my explanation (i.e.: for our scopes a thermal compound should be used, not for sure a thermal epoxy, which does not allow any further dismantling of the assembly), also if the picture I annexed was clearly a compound syringe, not relevant to a thermal epoxy.
For a general knowledge of a lot of thermal compounds available on the US market, I have found an interesting article at this address:
http://hardwarelogic.com/news/137/ARTICLE/2752/1/2008-03-03.html
The author shows also the availability of the "IC Diamond 7 Carat Thermal Compound" at a very affordable price (I have not been able to find it here in Italy: when you ask for a thermal compound in a computer store here, the best solution they offer is the arctic silver t.c.).
Sorry, the diode is NOT press fit into the module: technically speaking, press fit means interference and, without damaging the two surfaces that must be coupled, it can be obtained only with thermal shrinking of the "male" surface and thermal dilatation of the seating hole, but this is not the case. The simply fact that it is possible to fit the diode in the relevant housing at room temperature indicate that it is not a press fit.
In addition, the surface roughness, obtained with the traditional working processes (that is, without reaming and lapping), of the diode and of the housing (Al, Cu or brass, whatever is the metal used) does not allow a perfect contact for thermal transfer purposes, and in the case of Al it's necessary to take into account that it is a metal/alloy (2024, 7075, etc.) that easily oxidizes, with a further reduction in the time of the thermal transfer capability.
Off course, all this is valid where high temperatures capable to damage the device (in this case the diode) are foreseen, as Miloš has described in his last sentence.....
you're right, I regret I did not detail with the exact words my explanation (i.e.: for our scopes a thermal compound should be used, not for sure a thermal epoxy, which does not allow any further dismantling of the assembly), also if the picture I annexed was clearly a compound syringe, not relevant to a thermal epoxy.
For a general knowledge of a lot of thermal compounds available on the US market, I have found an interesting article at this address:
http://hardwarelogic.com/news/137/ARTICLE/2752/1/2008-03-03.html
The author shows also the availability of the "IC Diamond 7 Carat Thermal Compound" at a very affordable price (I have not been able to find it here in Italy: when you ask for a thermal compound in a computer store here, the best solution they offer is the arctic silver t.c.).
Sorry, the diode is NOT press fit into the module: technically speaking, press fit means interference and, without damaging the two surfaces that must be coupled, it can be obtained only with thermal shrinking of the "male" surface and thermal dilatation of the seating hole, but this is not the case. The simply fact that it is possible to fit the diode in the relevant housing at room temperature indicate that it is not a press fit.
In addition, the surface roughness, obtained with the traditional working processes (that is, without reaming and lapping), of the diode and of the housing (Al, Cu or brass, whatever is the metal used) does not allow a perfect contact for thermal transfer purposes, and in the case of Al it's necessary to take into account that it is a metal/alloy (2024, 7075, etc.) that easily oxidizes, with a further reduction in the time of the thermal transfer capability.
Off course, all this is valid where high temperatures capable to damage the device (in this case the diode) are foreseen, as Miloš has described in his last sentence.....
